SEMICON Taiwan 2012 to Spotlight Growing Market Opportunities in Taiwan
Driven by consumer demand for tablet, smartphone, and mobile devices, Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend nearly $40 billion in the next two years on equipment and materials, fueling excitement for SEMICON Taiwan 2012.
Market growth is expected in only two regions in 2012 - Taiwan and Korea - which will be the largest markets for capital equipment in 2012. According to the 2012 mid-year edition of the SEMI Capital Equipment Forecast, semiconductor equipment sales in Taiwan will increase from $8.5 billion in 2011 to $9.3 billion in 2012. Total semiconductor equipment sales worldwide are expected to reach $42.4 billion. This is an improvement from first quarter forecasts, driven by increased spending from Taiwanese foundries and OSATs. Investments from foundries are focusing on building advanced nodes capacities in order to meet strong demand for 28nm process.
"The overall Taiwan backend equipment market on the OSAT side is forecast at about $1.4 billion in 2012. Major OSATs are speeding up their advanced packaging investment in Taiwan to fulfill increased demand from mobile devices," states Terry Tsao, SEMI president of Taiwan and Southeast Asia. "The investment momentum in Taiwan could continue into 2013 especially from foundries. Both TSMC and UMC embarked on new multi-billion 300mm fab construction in the second quarter - aiming to provide sufficient capacity for 28nm and below in the years to come."
Taiwan is also world's leader in LED manufacturing with 41 LED fabs representing over 21 percent of the world's capacity, more than any other region (according to SEMI Opto/LED Fab Forecast report). The co-located LED Taiwan Exposition is the only event in Taiwan with a focus on LED manufacturing, attracting leading international companies including Canon, Epistar, Everlight, Fujitsu, IBM, Lite-On, Lextar, Unity Opto, Philips Lumileds, SAMPO and more. The LED Forum, co-organized with the Taiwan Optical Semiconductor Industry Association (TOSIA) will feature conference presentations from leading manufacturers and suppliers, including Brewer Science, Everlight, TSMC Solid State Lighting, and market research film Yole Développement.
Highlights of this year's SEMICON Taiwan include:
IC Expo: The only exposition in Taiwan focusing on the most advanced technologies and solutions for the IC design supply chain - from design to manufacturing - will attract Taiwan's growing fabless chip companies including ALi, ELAN, HIMX, MediaTek, MStar, Novatek, Pixart, Realtek, SiS, TM Technology and more. The IC Design Forum will feature presentations from ARM, ASE, Google, MediaTek, Synopsys and other industry leaders.
Theme Pavilions: Special theme pavilions at SEMICON Taiwan will feature product and programs on the latest developments in semiconductor and emerging markets, including MEMS, advanced packaging and testing technologies (including 3D-IC), green manufacturing, and secondary equipment market.
CEO Forum: CEO of Micron, COOs from ARM and TSMC and CTO of Corning will address topics on the theme "Embracing Change: Get Ready for the Challenge." A panel discussion will be conducted after the speeches.
Market Trends Forum: This event will feature a detailed analysis of and updated forecasts on semiconductor trends, including presentations from leading industry analysts Goldman Sachs, Citigroup, UBS, SEMI, and Yole Développement.
Supplier Research Program: Many of the semiconductor leading device makers, such as Panasonic, Renesas, Siltronic and Toshiba participate in the SEMICON Taiwan 2012 Supplier Search Program to find new strategic partners and service providers.
Other hot topics will be highlighted at SEMICON Taiwan 2012 including 450mm supply chain collaboration, green manufacturing solutions and secondary market in Taiwan.
The 2nd Annual SiP Global Summit to be in conjunction with SEMICON Taiwan 2012
According to Yole Développement, in 2011 the market value of all the devices using TSV packaged in 3D in the 3DIC or 3D-WLCSP platforms (CMOS image sensors, Ambient light sensors, Power Amplifiers, RF and inertial MEMS) was worth $2.7B. There has been much published and presented on some of the recent advancements in 2.5D (interposer) and 3D packaging, as well as product introductions using these technologies.
Supported by Amkor, ASE, ChipMos, Global Unichip, Mediatek, Nanya, SPIL, TSMC and many other international research organizations, this year SEMI will host the 2nd annual SiP Global Summit on Sept 6-7 in conjunction with SEMICON Taiwan 2012. The event consists of two major forums: 3D-IC Technology and Embedded Technology. Speakers from 20 of the world's top IT firms such as Amkor, Aptina, ASE, Intel, LSI, STATS ChipPAC, STMicroelectronics, UMC and Xilinx are scheduled to share their insights on 2.5D & 3D-IC, TSV, silicon interposer and embedded substrate technologies. Early-bird discount is available till August 10. For online registration and detailed forum information, visit: www.sipglobalsummit.org