IC China 2005: Summit and Technical seminar
The 3rd China International IC Industry Exhibition & Beijing Microelectronics International Seminar
A high-level summit and Beijing Microelectronics International forum and technical seminar will be simultaneously held within IC China 2005
Summit: 9:00~17:00, Aug.24, 2005 (500 people, 30 minutes for each speaker )
Technical Seminar: 9:00~17:00, Aug.25, 2005? 9:00~12:00, Aug.26, 2005 (100 people/per session, 25 minutes for each speaker)?
Venue: Century Golden Resources Hotel, Beijing
The speaker in the summit comes from the high level executive officer from well-known and large company. Correspondingly, Chinese high-level macro- policy makers, famous experts, related government officials and senior technical experts and high officials from foreign related association will be also invited to make speech in the summit.
The speaker in technical seminar comes from technical and management department of semiconductor-related company. The topics cover not only IC design, chip manufacture; discrete device, opto-electronic device, package and test, equipment and material, IC reliability technology , but system applications as auto electronics, HDTV, third generation mobile communication, VC and technology transfer.
More information, please visit www.ic-china.org or contact us:
China Semiconductor Industry Association
Ms. Louisa Lv, Mr. Li Ke
TEL:8610-68208589, 8610-88559904
FAX:8610-68208587
Email: Louisa@csia.net.cn, info@cisa.net.cn??
If you have interest to make speech in IC China 2005, please submit the application to us before June.30, 2005.
Conference Topics for IC China 2005
I?? Industry overview
?????●? Worldwide/China’s semiconductor IC industry and technology: The status quo and development trend
●? IP protection
● Technology innovation and HR training in China’s IC industry
●? The development in worldwide’s and China’s IC design, foundry, package and test industry
II? Technology
???? ● the design and test for CPU, DSP and SOC, IP core and design service
● Advanced manufacturing process, e.g. copper interconnection process, ArF optical exposure, 300mm technology etc.
● Advanced package technology, e.g. BGA, PGA, MCM, Flip chip, etc
III? Opto-electronics industry and market
IV System and application
???? ● Auto electronics and relevant technology
● HDTV
● Third generation mobile communication
V Economy and Technology cooperation and VC
???? ● The big commercial opportunity from Beijing Olympic
● Technology transfer and VC???
How can make speech in summit and technical seminar
1?Summit:
The speaker in the summit should be high-level executive officer from well-known and large company. The presentation material and papers should be of great guidance to the industry, or new and original in viewpoint, or involved advanced technology in content and examined and approved by the organizer.
A、?For those who apply for six or more stand stall, they can make one speech free in summit;
B、?For those who does not exhibit, after examined and approved by the organizer, they can make a speech in the summit through proper sponsorship.
2? Technical Seminar
Presentation materials and papers must be original and non-commercial in nature, focusing on technology rather than a specific company’s product and examined and approved by the organizer:
A、?For those who apply for two or more stand stall, they can enjoy one session free speech in technical seminar.
B、?For those who does not exhibit, make advertisement or provide sponsorship, they can make speech through paying RMB15000/per session.(or through providing sponsorship as stated in the summit)
C、?The cost for the special session for enterprise or products’ promotion can be negotiated with the organizer.
Attached for reference:?????????????
Agenda of Summit: IC CHINA 2004
1.?Chinese government officials, Ministry of Information Industry
??? China’s IT and semiconductor industry, the status quo and future development.
2.?Michel Mayer, Chairman and Chief Executive Officer of Freescale Semiconductor, Inc.
3.?Mark Durcan, Chief Technical Officer, Micron Technology, Inc.
4.?Hideo Ohtsubo, CEO of Tokyo Semitsu Co. Ltd, Chairman of SEAJ
???? Semiconductor Manufacturing Equipment for the 90nm generation and beyond
5.?Michael J. Fister, CEO, Cadence
6.?Richard Zhang, CEO and president, SMIC
???? Strategies spurring the growth of China's semiconductor industry
7.?Gilbert Declerck, CEO and president, IMEC:
???? IMEC’s Research on Design and Process Technologies
8.?Wang Yang Yuan, Academician, China Academy of Science
????? Dean, Department of Microelectronics, Peking University
????? Technology innovation and talent cultivations
9.?Xu Tao, Senior deputy general manager, VIA
10.?Setsuo Ogura, president, Renesas Technology China Co., Ltd
????? Ubiquitous IT era
11.?Shimpei Takeshita, Vice Chairman of the Board, Advantest Corporation
???? ? Innovation for Future Design And Manufacturing of LSI
12.?Katsube Yasuhiro, executive board director, Yokogawa Electric Corporation
????? ?A New Concept of SOC Testing for the New Partnership of China and Japan
?13.?Dr. HuShengFa, CEO, Anyka (Guangzhou) Software Technology Co., Ltd
?????? The processor in 2.5G to 3G mobile communication