San'an IC Selects the Mentor Graphics Calibre Platform for Verification of Advanced GaAs Wireless ICs
Mentor Graphics Corp.today announced that Xiamen San'an Integrated Circuit Co. Ltd. (San'an IC) has selected the Calibre® nmDRCTM and Calibre nmLVSTM products as its golden signoff physical verification solution for gallium arsenide (GaAs) ICs used in mobile and other wireless applications.
Designs are growing much more complex at all IC nodes as designers address new requirements such as low power, more operational modes, more protocols, redundancy and security. As a result, designers need more sophisticated tools that can handle complex requirements and still maintain fast turnaround.
"With radio frequency (RF) and sensor applications expanding rapidly, we need a single verification flow that can handle multiple technologies and process nodes," said Honda Huang, Design Support & Marketing Office director at San'an IC. "The Calibre platform gives us that flexibility—it works seamlessly with our RF design tools, and supports effective communication with our clients. The Calibre nmDRC and nmLVS products allow us to easily implement complex rules for RF design with very efficient commands and features like equation-based DRC that significantly reduce our coding effort."
"San'an IC's adoption of Calibre for advanced GaAs ICs used in RF applications is part of a growing worldwide trend to use the most advanced Calibre technologies for larger-feature-size applications," said Shu-Wen Chang, director of Calibre Foundry Programs at Mentor Graphics.
Xiamen San'an Integrated Circuit Co., Ltd. (San'an IC) is located in the Xiamen Torch High-tech Industrial Development Zone, with a total investment of three billion yuan on a planned area of 281 acres. It is one of Fujian Major Industrial Projects 2014-2018 and Xiamen Key Projects 2015, and an emerging industry of strategic importance with government support. San'an IC will build new production lines for gallium arsenide (GaAs) and gallium nitride (GaN) epitaxial wafers, as well as those for gallium arsenide (GaAs) high-speed semiconductor chips and gallium nitride (GaN) high-power semiconductor chips targeting microelectronic devices for wireless communication. Risk production is scheduled to start in the second half of 2015, and San'an IC will, upon volume production, become the first fab in China to combine large-scale R&D and manufacturing capabilities.